Only Available From Andon Electronics Corporation
Unique Design Avoids Cracking of Solder Joints and Ceramic Substrate:
- LCC Image Sensors are packed with up to 100 castellations (contacts).
- The ceramic substrace packaging presents new challenges for RoHS high temperature Soldering.
Eliminate the Cracking of LCC substrate and Solder Joints:
- Historically, Image Sensors are soldered directly on the printed circuit board (PCB).
- LCC Image sensors require longer soldering times for RoHS high temperature solders.
- The cermaic substrate "expands" while the solder joint is "fixed" and cracks.
Key benefits for Andon Electronics' patented LCC Sockets:
- Avoid color array high temperature soldering damage.
- Avoid electrostatic discharge (ESD) production line problems.
- Avoid cleaning solutions clouding glass cover.
* US Pat #5,588,847
